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Compact Fanless System with 6th/7 th Gen
Intel® Core™ i CPU Socket (LGA 1151)
Features
Intel ® 6th/7th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q170/
H110 chipset
Wide operating temperature (-10 ~ 50 °C)
VGA and DVI output
2 x GigaLAN and 8 x USB 3.0
1 x 2.5” HDD/SSD, 1 x CFast, and 1 x mSATA
2 x RS-232/422/485 and 4 x RS232 serial ports
9 ~ 36 V DC input power range
IP40 dust proof for deployment in harsh environment
Supports FlexIO and iDoor technology, flexible configure additional HDMI,
DVI, DIO, Remote switch IO
Supports Advantech i-Modules
Supports Advantech SUSIAPI and embedded software APIs
Supports IntelR vPro™/AMT and TPM technologies
Microsoft Azure Certified
Computer System | |
CPU | Intel ® 6th/7th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q170/ H110 chipset |
Memory | Dual-channel DDR4 2133/2400 MHz (without ECC) Socket 2 x 260-pin DDR4 SODIMM (up to 16 GB per socket) Maximum Capacity 32GB |
Storage | HDD 1 x 2.5" HDD/SSD (up to 2 x 2.5" SSD by optional kit; 2 x 3.5" HDD by i-Module) CFast 1 mSATA 1 RAID 0/1/5/10 (MIC-7700Q only) SATA Conn. Q170: 3 x SATA signal, 3 x SATA power H110: 1 x SATA signal, 1x SATA power |
USB | 170: 8 x USB 3.0 and 1 x internal USB 2.0 H110: 4 x USB 3.0 and 4 x USB 2.0 |
Ethernet | Q170 LAN1: Intel ® I219LM, LAN2: Intel® i210IT H110 LAN1: Intel® I219V, LAN2: Intel® i210IT Interface 2 x RJ45 |
Power Input | 9 ~ 36 V DC |
Dimensions (mm) | 77 x 192 x 230 mm |
Certifications | CE/FCC Class A, CCC, BSMI Safety: UL, CCC, BSMI |
File | Size | |
---|---|---|
MIC-7700_DS(050724).pdf | 1.89MB | Download |